Apple Service Diagnostics 3S151 MAC OSX
Production
Because Apple's international partners (in particular IBM) were already producing chips with the Power ISA, PowerPC chips were designed to be fully backwards-compatible with Power ISA (MIPS, SPARC and 68000) and later PowerPC instruction set. The first Power Mac G4 series shipped in 2001 with PowerPC 750 processor.
Performance
The PowerPC 750 processor has a clock rate of 300 MHz and can run up to five instructions per cycle (5-wide).
See also
 PowerPC processor comparison
 Power ISA
References
External links
 AMD XPA at All About Architecture
Category:Advanced Micro Devices x86 microprocessors
Category:ARM architectureThe present invention relates to a mold for shaping sheet material for forming cups, blanks and the like in a blow molding operation.
To form a blow molded container, a parison is extruded from a heated die. The parison is thereafter inflated in a mold to expand and fill the mold. The mold includes a main body which is formed by a parting surface, an internal sidewall and a base. The base is provided with a cavity defining the blow molding shape. The cavity is surrounded by an annular array of female threads to receive a male annular flange formed on the parison.
The mold is mounted on a reciprocating molding machine having an extrusion unit, a blow molding unit and a clamp unit. The molding machine is also provided with a cooling system for cooling the parison and a supply of liquid nitrogen for cooling the base and the mold itself. The extrusion unit is provided with a heated nozzle for extruding the parison from a heated die. The blow molding unit is provided with a female mold portion which surrounds the neck region of the parison and a male blow mold portion which is positioned on the external surface of the parison at the neck region and forms the container neck and finish.
The male portion of the blow mold portion is connected to a reciprocating blow mold carrier having a number of male blow mold elements which are brought together and clamped on the parison to form the container finish. The clamping pressure on the parison is provided by a pair of opposing dies. The dies each have a base surface surrounding the finish of the parison and an inclined surface adjacent to the base surface for clamping the parison therebetween. The blow mold carrier is provided with a cooling system for cooling the blow mold portion.
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