References
Category:1955 births
Category:Living people
Category:People from Epping
Category:American psychologists
Category:University of Maryland, College Park alumni
Category:University of California, Los Angeles faculty
Category:American Jews(a) Field of the Invention
The present invention relates to a method of preparing a thermal recording medium with a great width (hereinafter referred to as a "wide width recording medium"). More specifically, the present invention relates to a method of preparing a wide width recording medium without leaving any plane defects, free of any opening defects or scumming of ink, and capable of recording at a high speed.
(b) Description of the Prior Art
It is well known that ink has been provided for recording images upon a thermally sensitive recording medium (hereinafter referred to as a "thermal recording medium") such as a thermographic or sublimation type thermal recording paper. Such a thermal recording paper may be prepared by, for example, coating a dispersion or emulsion of a fine-particle thermoplastic binder such as poly(methyl methacrylate), polystyrene, or polyvinyl acetate on a paper substrate and then cross-linking it by, for example, heating it in the presence of a thermal hardening compound such as a quinone compound or a blocked isocyanate compound, as described in Japanese Patent Publications No. 45-3472 and No. 55-32380.
A thermal recording medium having a great width, as a great length of the recording medium is needed for the thermal recording of large size information, has been used in recent years. However, a conventional thermally sensitive recording medium has a small width of from about 10 mm to about 15 mm and has been limited in the lengths of the recording medium as a recording sheet. Moreover, as a thermal recording medium having a great width is prepared by coating a coating solution of a thermoplastic resin in an organic solvent on a paper substrate, the thermal recording medium having a great width has a small thickness. Therefore, when the coating solution of the thermoplastic resin is heated in the presence of a thermal hardening compound, a solvent included in the resin diffuses out from the coating solution of the thermoplastic resin and evaporates, thereby causing the shrinkage of the coating solution. Consequently, the coating layer is not heated evenly, resulting in the formation of planar defects or scumming in the coating layer.The 82fe58eafd
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