Low temperature curing epoxy adhesive
@owtemperaturecuringThis series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.@owtemperaturecuring has not made any collections public yet.