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Category:Telugu
Category:Telugu language
Category:Lists of films by languageThis invention relates to a process for the production of co-fired ceramic tubes and particularly to a process for co-firing a number of such tubes to form an integrated composite vessel.
It is known to produce ceramic articles by co-firing a number of individual ceramic parts to form a composite or single integral body. Although it is possible to co-fire all the individual parts using known methods and techniques, the process is relatively complicated and expensive and is particularly unsuitable for the production of small articles such as tubes. For example, there is difficulty in keeping the individual parts closely adjacent one another so that, when co-fired, the individual parts do not become dislodged, particularly when the parts are, for example, of small diameter or less than about 2 inches (50.8 mm) in diameter.Q:
Converting HTML to Markdown
Is there a service that will turn HTML to Markdown? 
If it has Markdown output, that's also a plus. 
A:
There are plenty of sites that do this. I don't know of any free ones, but the paid ones can be quite good. For example, I use the online version at  (it has a 30 day free trial).
The present invention relates to a method for effectively etching a wafer, and more particularly, to a method for etching a semiconductor wafer so as to expose a pattern on the surface of the wafer using a two-step etching process.
A semiconductor wafer is etched to expose a pattern on the surface thereof in order to manufacture a semiconductor device.
In the prior art, a wafer is etched using a single step. The single step process is a process of making a wafer surface have a pattern shape at one time by reacting an etchant liquid with the surface of the wafer. The single step process is typically carried out using a reactive ion etching (RIE) process in which a pattern is formed with a plasma. In a single step process, it is impossible to form a pattern which is not a rectangle or a square but rather a particular rectangle or square. Thus, it is difficult to carry out a wafer design which requires a complex pattern.
A two-step process has been suggested 82fe58eafd

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