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PDF Topcon Ml 1200 Manual Chilising AutoCode Software Free Download.How To Convert PDF to Word Documents using a free software. 1. Free Download all PDF files to Microsoft.1. Field of the Invention
The present invention generally relates to electrical circuits and systems and, more particularly, to electrical circuits and systems for driving a port pin of an integrated circuit (IC) device and application thereof.
2. Description of the Related Art
Integrated circuits (ICs) have become a ubiquitous part of modern life. The importance of ICs cannot be overstated since almost every electronic product that has been in use today, whether it is a computer, a cell phone, or a personal digital assistant, includes at least one IC. The ability to rapidly and reliably build new ICs is an important factor in the economy and growth of any society. The ability to more rapidly and reliably build more ICs requires increased IC packaging density and/or smaller ICs.
One problem that has not been adequately addressed is the large number of pins (e.g., more than 65,000) on each IC package. The large number of pins on each IC results in a large number of wires going into each IC and the IC packages. For example, an IC package for a cell phone may have as many as 20,000 wires going into the IC package. Each wire represents a pin on the IC that may be connected to external wiring during packaging. Each pin may have up to 65,000 wires attached to it in some configurations. For example, 65,000 wires may go into a pin of a typical, commercially available, 32-megabit DRAM device. This is a bit beyond even the most optimistic wire counts that have been achieved for the semiconductor industry. Thus, there is an enormous wiring burden for IC manufacturers, IC packaging manufacturers, and IC users.
Further, in a typical package for an IC, only a small percentage of the pins are utilized for providing external connections. Typically, only 30% of the pins of a package are used for providing external connections while the remaining 70% of the pins are unused. This percentage does not change even if the amount of metal used to fabricate the pins increases. As a result, the cost to manufacture IC packages is relatively high. Further, it is relatively difficult to manufacture IC packages to different ICs with different pin counts because the number and placement of pins, in general, is not variable. Further, it is relatively expensive to customize a package for an

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