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feel free to Contact Us.In the manufacture of a microelectronic device, for example, a die is attached to a packaging substrate. Bonding materials such as solder or other materials are placed between the die and the packaging substrate. The die, packaging substrate and bonding materials are then heated to reflow the bonding materials and/or to form a mechanical joint between the die and the packaging substrate. Typically, the die and the substrate have corresponding protrusions and recesses or pads. The protrusions in the die protrude into corresponding recesses in the substrate and the bonding materials are placed in the recesses to form a mechanically bonded joint. The bonding materials may be made of a metal, ceramic, plastic, or a composite material. The bonding materials may include a diffusion barrier such as Ti/Cu, Ni/Cu or W/Cu.
For example, U.S. Pat. No. 6,726,489 teaches a single bond with a diffusion barrier layer to reduce interdiffusion. U.S. Pat. No. 5,854,353 teaches an assembly with a copper layer that acts as a diffusion barrier layer. U.S. Pat. No. 6,884,403 teaches a method of forming a metallized substrate by first forming a metallized film on a barrier material. The metallized film can include a diffusion barrier layer. The method includes cleaning the barrier material by removing corrosive substances.
However, as the demand for smaller microelectronic devices continue to increase, the need for smaller bond lines continues to increase as well. For example, a flip-chip die can be attached to a packaging substrate with a bond line having a width less than 100 microns. The bonding process typically uses short, high-energy pulses of ultrasonic energy, for example, to melt the bonding materials so that the materials become viscous, and then solidify to form an alloy joint. With the decreasing bond line width, the fatigue lifetime of the joint can be reduced.Peter O'Toole turns 79: A festive home for Mr. Actor
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Today marks Peter O'Toole's 79th birthday, and the internet is calling this "a festive home for Mr.
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Jolene's Vegetable Stew with Corn And Cheese
Total Time
1hr30mins
Prep
30 mins
Cook
1 hr 30 mins
This easy recipe is fantastic served with pasta, polenta or a simple green salad. Serve it with baked potatoes or corn on the cob on the side.
Recipe courtesy of The Slow Cookin' Cookbook.
Place in a large stockpot:10 cups of water, potatoes, and chopped garlic. Add 1 tablespoon salt and bring to a boil, then reduce heat and simmer for 20 minutes. Using tongs, transfer potatoes to a bowl.Q:
Let's get critical: Aug 2015 Site Self-Evaluation
We all love Community Management Stack Exchange, but there is a whole world of people out there who need answers to their questions and don't even know that this site exists. When they arrive from Google, what will their first impression be? Let's try to look at this site through the eyes of someone who's never seen it before, and see how we stack up against the rest of the 'Net.
The Site Self-Evaluation review queue is open and populated with 10 questions that were asked and answered in the last quarter. 
Run a few Google searches to see how easy they are to find and compare the answers we have with the information available on other sites.
Rating the questions is only a part of the puzzle, though. Do you see a pattern of questions that should have been closed but are not? Questions or answers that could use an edit? Anything that's going really well? Post an answer below to share your thoughts and discuss these questions and the site's health with your fellow users!
A:
Final Results
How can I put my business in a 100% transparent manner?
Net Score: 4 (Excellent: 5, Satisfactory: 3, Needs Improvement: 1)
Suggested edits for Business Expenses Format?
Net Score: 2 (Excellent: 3, Satisfactory: 4, Needs Improvement: 1)
What type of a membership
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